Jose Bethzaida San Andres
Inventor, Mechanical Engineer, BA in Economics, MBA in Technology Mgmt & Masters in Finance & Accounting
Over 30 years of experience in Manufacturing, with Lean Six Sigma mindset, in Injection Molding, book/compression molding, extrusion, blow molding, metal forming/stamping that caters to automotive, medical, electronic, and aerospace industries. Disciplined in manufacturing engineering and mechanical design for thermoplastic and metal alloy production tooling design, process efficiency, ease of assembly, quality, and validation. Strong background in injection molding, Hot Stamping, Pad Printing, Thermal staking, Sonic Welding, Laser Engraving, Hot/Cold forging, CNC lathe/Mill, and Metal stamping manufacturing processes, and with strong working knowledge of DFM/A, DOE, GD&T, PFMEA, DFMEA, SPC, PPAP and IQ,OQ,PQ Validation process. With years of experience moving/setting up cellular manufacturing facilities domestically and internationally. Strategic thinker with compassion in attention to detail for manufacturing producibilities and manufacturing cost. Exceptional leadership and partnership with functional and departmental management in metrics and traditional organizational structures proven to be an effective trait for Project management. Superb presentation skills, briefing packages development, and facilitating consensus and “third alternative” solutions. Project focus with detailed understanding of project management principles such as project valuation, cost variances, schedule variances, and risk management (NPV, IRR &ROI). Over 25 years (hands-on) experience in Solidworks software for Mechanical Design and Lean Layout planning. Cradle-to-grave lifecycle experience in white paper space, proof-of-concept, design and development, tech insertion, service-life-extension and sustainment, maintenance, and repairs. Possess a hybrid empathetic, motivational, and problem-solving leadership style, and possess an organized, detailed, informative, and hands-on project management style.
Manufacturing Engineering
Six Sigma
Lean Manufacturing Concept
New Product Introduction
Process Failure Mode & Effect Analysis
Process Documentation
Manufacturing Risk Reduction
Integration, Evaluation & Test
Business Management
Cost, Sched, Tech Performance
Management
Business Development & Mgmt
Risk Management
Operation Management
Continous Process Improvement
Strategic Thinking
Technology Leverage Analysis
Task Order Development & Mgmt
Capture Strategy Development
Procurement Strategy Development
Partnering Assessments
Business Case Development
US PATENTS (United State Patent Trade Office)
Jose B San Andres – Inventor September 2003: US 6618268 (10 worldwide citation) A method, apparatus, and article of manufacture for providing power from a first circuit board having a first circuit board first conductive surface and a first circuit board second conductive surface to a second circuit board having a second circuit board first conductive surface and a second February 2002: US 20020015288 (5 worldwide citation). A thermal mechanical interface usable between a heatsink and a heat dissipating device is disclosed. In one embodiment, the thermal mechanical interface comprises a thermally conductive mechanically resilient member having a corrugated cross section and a first thermal conductance, disposed November 2001: US 20010036066A method, apparatus, and article of manufacture for providing power from a first circuit board having a first circuit board first conductive surface and a first circuit board second conductive surface to a second circuit board having a second circuit board first conductive surface.
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